Highness Microelectronics IPO
Bookbuilding IPO | ₹22.00 Cr | Listing at BSE SME
IPO Open
Tue, Mar 24, 2026
IPO Close
Fri, Mar 27, 2026
Price Band
₹114.00 to ₹120.00
Market Cap (Pre-IPO)
₹61.96 Cr
IPO Details
| IPO Date | Mar 24, 2026 to Mar 27, 2026 |
| Listing Date | Tentative: Apr 02, 2026 |
| Face Value | ₹10.00 per share |
| Price Band | ₹114.00 to ₹120.00 |
| Lot Size | 1200 Shares (Minimum: ₹144,000.00) |
| Sale Type | Offer For Sale + Fresh Issue |
| Issue Type | Bookbuilding IPO |
| Listing At | BSE SME |
| Issue Size | ₹22.00 Crores |
| Total Shares Offered | 1,806,000 shares |
| Fresh Issue | 1,562,400 shares |
| Offer For Sale | 152,400 shares |
Highness Microelectronics IPO Reservation
| Investor Category | Shares Offered |
|---|---|
| QIB Shares Offered | 8,53,200 (47.24%) |
| Retail Shares Offered | 6,02,400 (33.36%) |
| NII Shares Offered | 2,59,200 (14.35%) |
Highness Microelectronics IPO Lot Size
Investors can bid for a minimum of 2,400 shares and in multiples of 1,200 shares thereof.
| Application | Lots | Shares | Amount |
|---|---|---|---|
| Retail (Min) | 2 | 2,400 | ₹288,000 |
| Retail (Max) | 2 | 2,400 | ₹288,000 |
| S-HNI (Min) | 3 | 3,600 | ₹432,000 |
| S-HNI (Max) | 6 | 7,200 | ₹864,000 |
| B-HNI (Min) | 7 | 8,400 | ₹1,008,000 |
Highness Microelectronics Financial Information (Restated Consolidated)
| Period Ended | 31 Dec 2025 | 31 Mar 2025 | 31 Mar 2024 | 31 Mar 2023 |
|---|---|---|---|---|
| Assets | 24.03 | 14.31 | 8.20 | 4.78 |
| Total Income | 14.41 | 14.17 | 10.99 | 9.91 |
| Profit After Tax | 3.41 | 2.52 | 2.39 | 0.44 |
| EBITDA | 5.55 | 4.52 | 5.97 | 3.13 |
| NET Worth | 10.03 | 6.62 | 4.10 | 1.71 |
| Reserves and Surplus | 6.52 | 3.11 | 4.09 | 1.70 |
| Total Borrowing | 8.20 | 4.93 | 1.38 | 1.36 |
Amount in ₹ Cr
Key Performance Indicators
As of Monday, March 31, 2025| KPI | Values |
|---|---|
| ROE (Return on Equity) | 47.09% |
| ROCE (Return on Capital Employed) | 42.09% |
| Debt/Equity | 0.74 |
| RoNW (Return on Net Worth) | 47.09% |
| EBITDA Margin | 32.11% |
| Price to Book Value | 6.37 |
| Pre IPO | Post IPO | |
|---|---|---|
| EPS Rs | 7.19 | 8.81 |
| P/E (x) | 16.70 | 13.63 |
| Promoter Holding | 99.90% | 64.96% |
Company Promoters
- Mr. Gaurav Manjul Kejriwal
- Mr. Manjul Kumar Kejriwal
- and Mrs. Shruti Gaurav Kejriwal are the company promoters.
Company Overview
Highness Microelectronics – Company Overview
- Incorporated in 2007, Highness Microelectronics Limited is engaged in the design, development, assembly, and manufacturing of digital imaging and display solutions, with ISO 9001:2015 and ISO 13485:2016 certifications ensuring quality standards.
Product Segments
- Off-the-Shelf Products: Includes TFT/LCD modules, display controllers, touch screens, cable assemblies, backlight drivers, and display enhancement solutions.
- Customized Solutions / Projects: Offers industrial-grade, medical-grade, and panel-mounted display systems tailored to client requirements.
- The company provides advanced display enhancement features such as high brightness for outdoor use, wide temperature tolerance, EMI shielding, NVIS compatibility, and optical bonding for improved clarity and durability.
- It serves multiple industries including industrial automation, healthcare, transportation (railways, metros, automobiles), and defence, focusing on delivering reliable, high-performance, and application-specific display technologies.
Company Strengths
- Quality Standards and ISO certified organization
- Customization Expertise
- Strong relationship with customers
- Weather-Resistant Display Solutions
Use of Proceeds
| 1) | Funding the capital expenditure towards setting up an assembly line at factory situated at R-364, TTC Industrial Area, Rabale, Mumbai-400701 | 5.27 |
| 2) | Funding the working capital requirement of our Company. | 6.71 |
| 3) | Repayment and/or pre-payment, in full or part, of borrowing availed by our Company. | 1.89 |
| 4) | General Corporate Purposes * | |
| Total | 13.87 |
Objectives
The Company proposes to utilise the Net Proceeds from the Issue towards the following objects:
Quick Info
| Sector | Electronics System Design & Manufacturing (ESDM) |
| Exchange | BSE SME |
| Market Cap (Pre-IPO) | ₹61.96 Cr |
Important Dates
| IPO Open | Mar 24, 2026 |
| IPO Close | Mar 27, 2026 |
| Allotment Date | Mar 30, 2026 |
| Credit to Demat | Apr 01, 2026 |
| Listing Date | Tentative: Apr 02, 2026 |
Lead Manager(s)
Fintellectual Corporate Advisors Pvt.Ltd.
Registrar
Skyline Financial Services Pvt.Ltd.
02228511022
Description
- IPO Type: Book build issue aggregating to ₹21.67 crores.
- Issue Structure: Combination of a fresh issue of 0.17 crore shares (₹19.84 crores) and an offer for sale of 0.02 crore shares (₹1.83 crores).
- IPO Dates: The issue opens on March 24, 2026 and closes on March 27, 2026.
- Allotment Date: Expected to be finalized on March 30, 2026.
- Listing Details: Shares are proposed to be listed on the SME platform of BSE Limited (BSE SME) with a tentative listing date of April 2, 2026.
- Retail Investment Requirement: Minimum 2 lots (2,400 shares) amounting to approximately ₹2,88,000 at the upper price band.
- HNI Investment Requirement: Minimum 3 lots (3,600 shares) totaling around ₹4,32,000.
- IPO Price Band: ₹114 to ₹120 per equity share.
- Lot Size: 1,200 shares per lot.
This IPO offers investors an opportunity to participate in the SME electronics and semiconductor-related sector, subject to market risks.